Mems process and device

ABSTRACT

A MEMS device, for example a capacitive microphone, comprises a flexible membrane  11  that is free to move in response to pressure differences generated by sound waves. A first electrode  13  is mechanically coupled to the flexible membrane  11 , and together form a first capacitive plate of the capacitive microphone device. A second electrode  23  is mechanically coupled to a generally rigid structural layer or back-plate  14 , which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate  1,  for example a silicon wafer. A back-volume  33  is provided below the membrane  11 , and is formed using a “back-etch” through the substrate  1.  A first cavity  9  is located directly below the membrane  11 , and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes  13  and  23  is a second cavity  17,  which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes  15  connect the first cavity  9  and the second cavity  17.  Acoustic holes  31  are arranged in the back-plate  14  so as to allow free movement of air molecules, such that the sound waves can enter the second cavity  17.  The first and second cavities  9  and  17  in association with the back-volume  33  allow the membrane  11  to move in response to the sound waves entering via the acoustic holes  31  in the back-plate  14.  The provision of first and second sacrificial layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes  15  aid with the removal of the first and second sacrificial layers. The bleed holes  15  also contribute to the operating characteristics of the microphone.

FIELD OF THE INVENTION

This invention relates to a MEMS process and device, and in particularto a MEMS process and device relating to a transducer, and in particulara capacitive microphone.

BACKGROUND OF THE INVENTION

Consumer electronics devices are continually getting smaller and, withadvances in technology, are gaining ever increasing performance andfunctionality. This is clearly evident in the technology used inconsumer electronic products such as mobile phones, laptop computers,MP3 players and personal digital assistants (PDAs). Requirements of themobile phone industry for example, are driving the components to becomesmaller with higher functionality and reduced cost. It is thereforedesirable to integrate functions of electronic circuits together andcombine them with transducer devices such as microphones and speakers.

The result of this is the emergence ofmicro-electrical-mechanical-systems (MEMS) based transducer devices.These may be for example, capacitive transducers for detecting and/orgenerating pressure/sound waves or transducers for detectingacceleration. There is a continual drive to reduce the size and cost ofthese devices through integration with the electronic circuitrynecessary to operate and process the information from the MEMS throughthe removal of the transducer-electronic interfaces. One of thechallenges in reaching these goals is the difficultly of achievingcompatibility with standard processes used to fabricatecomplementary-metal-oxide-semiconductor (CMOS) electronic devices duringmanufacture of MEMS devices. This is required to allow integration ofMEMS devices directly with conventional electronics using the samematerials and processing machinery. This invention seeks to address thisarea.

Microphone devices formed using MEMS fabrication processes typicallycomprise one or more membranes with electrodes for read-out/drivedeposited on the membranes and/or a substrate. In the case of MEMSpressure sensors and microphones, the read out is usually accomplishedby measuring the capacitance between the electrodes. In the case oftransducers, the device is driven by a potential difference providedacross the electrodes.

FIG. 1 shows a capacitive microphone formed on a substrate 2. A firstelectrode 4 is mechanically connected to a membrane 6. A secondelectrode 8 is mechanically connected to a structurally rigid back-plate14. During the manufacture of the MEMS device described above, themembrane 6 is formed using a sacrificial layer located between themembrane 6 and the second electrode 8. A back-volume 12 is formed usingan etching process from below the substrate, known as a “back-etch”. Thesacrificial layer between the membrane 6 and second electrode 8 isremoved later in the process to leave the membrane 6 suspended and freeto move.

A disadvantage of the process described above is that the back-etch isdifficult to perform in an accurate manner when using a wet-etch or adry-etch. In other words, it is difficult to obtain a consistentback-volume, particularly when performing a wet back-etch, since thesides of the back-volume tend to converge inwards as they approach thefirst electrode 4 and membrane 6, rather than being parallel as shown inthe ideal scenario of FIG. 1. This tapering of the back-etch can alterthe dimensions of the electrode 4 and membrane 6, and thereby change theoperating characteristics of the microphone such as its frequencyresponse and sensitivity.

It will also be appreciated that, in order to incorporate thetransducers into useful devices, it is necessary to interface or couplethem to electronic circuitry, which may either be located on the samesubstrate or a separate integrated circuit. However, this can lead toproblems with interference, noise and parasitic capacitance andinductance.

Typically the membranes are thin, of the order of tenths of a micron,and can range in size from tens to thousands of microns. As a result,the devices can be fragile and may be damaged during singulation.Singulation is a process in which a substrate wafer on which the MEMSdevices are fabricated is diced up so that only one device (or a groupof devices) is found on each diced piece. This process is typicallyachieved by dicing the wafer with a high-speed rotating diamond blade.Alternatively the wafer may be cut up using a laser, or scribed andcleaved along a crystallographic axis. All of these dicing methods haveassociated problems when applied to MEMS structures.

During blade singulation the surface of the wafer is typically floodedwith a lubricating coolant, usually water, that is meant to prevent thetemperature of the wafer from becoming too high and to ensure thediamond blade stays in a safe operating range. This produces a slurryfrom the water and abraded pieces of wafer that may penetrate any openpart of the MEMS structure and render it useless, as it is difficult toclean the slurry out at a later stage due to the small size of thesingulated devices. Additionally, the lubricating coolant may be sprayedonto the wafer at high speed thus placing any delicate sensor structureunder high mechanical stress and potentially damaging it.

Laser singulation is slightly cleaner than blade dicing but is moreexpensive. However, the heating produced by the cutting process may setup thermal gradients leading to areas of different thermal expansion inthe sensor structures that may distort them and render them useless.Also the laser singulation process produces some residue that may clogany open structure and prevent the device from operating properly.

Finally, singulating the wafer by scribing and cleaving places extremelyhigh mechanical stress on the wafer during the cleaving process andproduces a large amount of debris that may damage the device as above.

SUMMARY OF THE INVENTION

According to a first aspect of the invention, there is provided a methodof fabricating a micro-electrical-mechanical system (MEMS) transducer ona substrate. The method comprises the steps of depositing a firstsacrificial layer with respect to a first side of a membrane; depositinga second sacrificial layer with respect to a second side of themembrane; and removing the first and second sacrificial layers so as toform a MEMS transducer in which the membrane is moveable.

The provision of first and second sacrificial layers has a number ofadvantages. First, the sacrificial layers help protect the membraneduring other fabrication steps. Secondly, the first and secondsacrificial layers enable the size of the membrane to be formedindependent of a subsequent back etch process.

According to another aspect of the invention, there is provided a methodof fabricating a micro-electrical-mechanical system (MEMS) microphone ona substrate. The method comprises the steps of: depositing first andsecond electrodes; depositing a membrane, the membrane beingmechanically coupled to the first electrode; and depositing a backplate, the back plate being mechanically coupled to the secondelectrode. The step of depositing the membrane further comprises thestep of depositing the membrane on a first sacrificial layer. The methodfurther comprises the steps of: depositing a second sacrificial layer inan area between the first and second electrodes; and removing the firstand second sacrificial layers so as to form a MEMS microphone having afirst cavity beneath the membrane, and a second cavity between the firstand second electrodes, such that the membrane and the first electrodeare able to move relative to the second electrode.

According to a further aspect of the invention, there is provided amicro-electrical-mechanical system (MEMS) capacitive microphonecomprising: first and second electrodes; a membrane that it ismechanically coupled to the first electrode; and a back plate that it ismechanically coupled to the second electrode; wherein the first andsecond electrodes each have a diameter that is different to the diameterof the membrane.

According to a further aspect of the invention, there is provided amicro-electrical-mechanical system (MEMS) capacitive microphonecomprising: first and second electrodes; a membrane that it ismechanically coupled to the first electrode; and a back plate that it ismechanically coupled to the second electrode; wherein the secondelectrode comprises one or more openings.

According to a further aspect of the invention, there is provided amethod of fabricating a micro-electrical-mechanical system (MEMS)microphone. The method comprises the steps of: depositing first andsecond electrodes; depositing a membrane that it is mechanically coupledto the first electrode; and depositing a back plate that it ismechanically coupled to the second electrode; wherein the step ofdepositing the second electrode comprises the step of forming apredetermined pattern in the second electrode, and wherein thepredetermined pattern comprises one or more openings.

According to a further aspect of the invention, there is provided amethod of testing a plurality of micro-electrical-mechanical system(MEMS) microphones formed on a wafer, each MEMS microphone comprising amembrane and at least one sacrificial layer. The method comprises thesteps of: attaching the wafer to a carrier: singulating the wafer toform two or more MEMS microphones; removing the at least one sacrificiallayer; and testing the MEMS microphones while attached to the carrier.

According to a further aspect of the invention, there is provided amicro-electrical-mechanical system.(MEMS) microphone comprising: asubstrate; first and second electrodes; a membrane that it ismechanically coupled to the first electrode; and a back plate that it ismechanically coupled to the second electrode; and further comprising: afirst cavity beneath the membrane, the first cavity formed using a firstsacrificial layer; and a second cavity between the first and secondelectrodes, the second cavity formed using a second sacrificial layer.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the invention, and to show more clearlyhow it may be carried into effect, reference will now be made, by way ofexample only, to the accompanying drawings in which:

FIG. 1 is a schematic cross-sectional view of a MEMS microphone;

FIG. 2 is schematic cross-sectional view of a MEMS microphone accordingto the present invention;

FIG. 3 is a perspective view of the MEMS microphone shown in FIG. 2;

FIGS. 4 to 19 are schematic cross sectional views and perspective viewsillustrating the fabrication process for the MEMS microphone detailed inFIGS. 2 and 3;

FIG. 20 shows an electrode according to another aspect of the presentinvention; and

FIGS. 21 a, 21 b and 21 c illustrate the positioning of bleed holes.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIGS. 2 and 3 show a schematic diagram and a perspective view,respectively, of a capacitive microphone device according to the presentinvention. The capacitive microphone device comprises a flexiblemembrane 11 that is free to move in response to pressure differencesgenerated by sound waves. A first electrode 13 is mechanically coupledto the flexible membrane 11, and together they form a first capacitiveplate of the capacitive microphone device. A second electrode 23 ismechanically coupled to a generally rigid structural layer or back-plate14, which together form a second capacitive plate of the capacitivemicrophone device.

The capacitive microphone is formed on a substrate 1, for example asilicon wafer. A back-volume 33 is provided below the membrane 11, andis formed using a “back-etch” through the substrate 1, as will bedescribed in greater detail later in the application. A first cavity 9is located directly below the membrane 11. The first cavity 9 is formedusing a first sacrificial layer during the fabrication process.Interposed between the first and second electrodes 13 and 23 is a secondcavity 17. The second cavity 17 is formed using a second sacrificiallayer during the fabrication process. A plurality of openings,hereinafter referred to as bleed holes 15, connect the first cavity 9and the second cavity 17. A further plurality of openings, hereinafterreferred to as acoustic holes 31, are arranged in the back-plate 14 soas to allow free movement of air molecules, such that the sound wavescan enter the second cavity 17.

The first and second cavities 9 and 17 in association with theback-volume 33 allow the membrane 11 to move in response to the soundwaves entering via the acoustic holes 31 in the back-plate 14.

As will be appreciated more fully from the detailed description of thefabrication process in FIGS. 4 to 19 below, the provision of first andsecond sacrificial layers has the advantage of disassociating theetching of the back-volume from the formation of the membrane 11. Inparticular, the formation of the first cavity 9 using the firstsacrificial layer means that the etching of the back-volume does notplay any part in defining the diameter of the membrane. Instead, thediameter of the membrane 11 is defined by the diameter of the firstcavity 9 (which in turn is defined by the diameter of the firstsacrificial layer) in combination with the diameter of the second cavity17 (which in turn is defined by the diameter of the second sacrificiallayer). As will be explained in more detail below, the diameter of thefirst cavity 9 formed using the first sacrificial layer can becontrolled more accurately than the diameter of a back-etch processperformed using a wet-etch or a dry-etch.

The bleed holes 15 connecting the first cavity 9 with the second cavity17 have numerous advantages. For example, during the fabrication processthe bleed holes 15 assist with the removal of the first and secondsacrificial layers. In particular, when etching from above the membrane11 using a dry etch process, for example, the bleed holes 15 allowportions of the first sacrificial layer that have not been previouslyetched during a back-etch process to be etched via the bleed holes 15,i.e. from above the device. In other words, once the etching processfrom above the membrane has removed the second sacrificial layer in thesecond cavity 17, the bleed holes 15 enable the etching process toremove the first sacrificial layer in the areas under the bleed holes15, in the outer area of the first cavity 9.

In addition, once the sacrificial layers have been removed, the bleedholes 15 allow a limited or restricted flow of air to pass from thesecond cavity 17 to the first cavity 9 and back-volume 33. The tortuouspath of this air flow helps improve the operating characteristics of thecapacitive microphone at certain frequencies. For example, the bleedholes 15 may be configured such that they provide low resistance forpressure waves having a frequency of less than about 20 Hz (i.e. thebottom end of the human audible range), and providing greater resistanceto higher frequency pressure waves. This ensures that the higherfrequency pressure signals act on the membrane, rather than bypassingthe membrane via the bleed holes 15. This characteristic of thecapacitive microphone has the advantage of damping or eliminatingundesired low frequency signals, for example wind noise, by allowingsuch undesired signals to bypass the membrane. It is noted that thefrequency response of the device follows the classic 1/-RC relationship,where in this case R relates to the restricted flow of air through thebleed holes 15, and C relates to the volume of the back-volume 33. Itwill therefore be appreciated that the operating characteristics of thedevice can be altered by tuning the position and size of the bleed holes15 and/or back-volume 33 during the manufacturing process. It is alsonoted that the frequency response of the device can be tuned accordingto the characteristics of the electronic circuitry with which themicrophone is intended to interface.

Further details of the aspects described above will be provided later inthe application with reference to FIGS. 4 to 19.

In order to process an electrical output signal from the microphone, thedevice may have circuit regions (not shown) that are integrallyfabricated using standard CMOS processes on the substrate 1. The circuitregions may comprise conducting (for example aluminium or copper)circuit interconnects that are used to electrically connect to themicrophone via interconnect points to the circuit region.

The circuit regions may be fabricated in the CMOS silicon substrateusing standard processing techniques such as ion implantation,photomasking, metal deposition and etching. The circuit regions maycomprise any circuit operable to interface with a MEMS microphone andprocess associated signals. For example, one circuit region may be apre-amplifier connected so as to amplify an output signal from themicrophone. In addition another circuit region may be a charge-pump thatis used to generate a bias, for example 10 volts, across the twoelectrodes. This has the effect that changes in the electrode separation(i.e. the capacitive plates of the microphone) change the MEMSmicrophone capacitance; assuming constant charge, the voltage across theelectrodes is correspondingly changed. A pre-amplifier, preferablyhaving high impedance, is used to detect such a change in voltage.

The circuit regions may optionally comprise an analogue-to-digitalconverter (ADC) to convert the output signal of the microphone or anoutput signal of the pre-amplifier into a corresponding digital signal,and optionally a digital signal processor to process or part-processsuch a digital signal. Furthermore, the circuit regions may alsocomprise a digital-to-analogue converter (DAC) and/or atransmitter/receiver suitable for wireless communication. However, itwill be appreciated by one skilled in the art that many other circuitarrangements operable to interface with a MEMS transducer signal and/orassociated signals, may be envisaged.

It will also be appreciated that, alternatively, the microphone devicemay be a hybrid device (for example whereby the electronic circuitry istotally located on a separate integrated circuit, or whereby theelectronic circuitry is partly located on the same device as themicrophone and partly located on a separate integrated circuit) or amonolithic device (for example whereby the electronic circuitry is fullyintegrated within the same integrated circuit as the microphone).

The microphone has a diameter of typically 1 mm. Other dimensions areprovided below as examples in relation to the fabrication process.

The operation of the microphone will now be briefly described. Inresponse to a sound wave corresponding to a pressure wave incident onthe microphone, the membrane 11 is deformed slightly from itsequilibrium position. The distance between the lower electrode 13 andthe upper electrode 23 is correspondingly altered, giving rise to achange in capacitance between the two electrodes that is subsequentlydetected by electronic circuitry (not shown).

The process by which the above embodiment may be fabricated will now bedescribed with reference to FIGS. 4-19 and with reference to theelements described above in FIG. 2.

FIGS. 4 to 19 are schematic cross-sectional and/or perspective viewsillustrating the fabrication process for the MEMS microphone shown inFIGS. 2 and 3.

In the description of FIGS. 4 to 19 it is noted that various dimensions(both written and illustrated) are provided as examples only.Furthermore, references to stress values and targets are intended torefer to the resultant layer/feature stresses for the fully processedMEMS device, and not the stresses of the individual layer/feature asdeposited.

Referring to FIG. 4, the fabrication process of the MEMS device is basedon a substrate 101. In this example, for integration with CMOSelectronics and CMOS processing techniques the substrate 101 is asilicon wafer, but it will be appreciated that other substrate materialsand electronic fabrication techniques could be used instead. The siliconsubstrate 101 is subjected to thermal oxidation to form thermaloxidation wafer layers 103 and 105. The silicon substrate 101 has athickness, for example, in the range 300 um to 1000 um, for example 625um. Each thermal oxidation layer 103, 105 has a thickness of up to 15um, for example 0.6 um. It is noted that the thermal oxidation layers103, 105 are compressive. As an alternative to using thermal oxidation,the oxide layers may be deposited using a plasma enhanced chemicalvapour deposition (PECVD).

In FIG. 5 a dielectric layer, for example a silicon nitride dielectriclayer 107, is deposited on the thermal oxidation layer 103. The siliconnitride dielectric layer 107 can be deposited using a process such asplasma enhanced chemical vapour deposition (PECVD) at a temperature of300° C. The silicon nitride dielectric layer 107 acts as an etch stoplayer during subsequent processing of the MEMS device (and in particularin relation to the etching of the back-volume described below in FIG.18). Preferably the silicon nitride dielectric layer 107 has a thicknessin the range 2.3 um to 2.7 um, for example 2.5 um, and a tensile stressof between 25 to 75 MPa, for example 50 MPa. It will be appreciated thatother dielectric layers and/or processes may be used. For example thelayer might not be pure silica—BoroPhosphoSilicate Glass or BPSG mayalso be used as it can be deposited at lower temperatures. It will beappreciated by a person skilled in the art that the stress of a layerwill not only relate to the thickness of the layer, but also thedeposition conditions.

Next, referring to FIG. 6 a, a first sacrificial layer 109 is formed onthe silicon nitride dielectric layer 107 by depositing and etching acoating. To ensure compatibility with CMOS fabrication techniques, thefirst sacrificial layer 109 can be made of a number of materials whichcan be removed using a dry release process. Using a dry release processis advantageous in that no additional process steps or drying arerequired after the sacrificial layer is released. Polyimide ispreferable as the sacrificial layer (for example Hitachi Dupontpolyimide PI2610 or PI2545), as it can be spun onto the substrate easilyand removed with an oxygen plasma clean. The polyimide coating is spunon the wafer to form a conformal coating, and subsequently cured at atemperature of 200° C. for 30 minutes in air at atmospheric pressure,and then at 375° C. for 30 minutes in a flowing nitrogen environment atatmospheric pressure. It will be appreciated by a person skilled in theart that the values of these parameters are provided as examples onlyand that any conditions suitable to deposit a polyimide sacrificiallayer may be envisaged. A primer may be used for the polyimide layer,such as HD VM651 for example. The polyimide layer is then patterned withphotoresist and etched in an anisotropic oxygen plasma, thus leaving thefirst sacrificial layer 109 as shown in FIG. 6 a. The first sacrificiallayer 109 has a thickness, for example, of between 0.9 um to 1.1 um, forexample 1 um. It will appreciated by a person skilled in the art thatalternative methods of depositing the first sacrificial layer 109 may beused, for example applying and etching a photosensitive polyimide.

The first sacrificial layer 109 defines the dimensions and shape of thecavity underneath the membrane (i.e. the first cavity 9 in FIG. 2) thatwill be left when the first sacrificial layer 109 is removed asdiscussed below. In addition to creating the first sacrificial layer109, the etching of the polyimide coating may also involve the formationof identification and/or alignment features (for example 110, 110 a, 110b shown in FIG. 6 b in perspective view). The identification andalignment features assist with the subsequent processing of the MEMSdevice.

The first sacrificial layer 109 is provided for a number of reasons.These include supporting and protecting the membrane of the MEMS deviceduring the manufacturing process. The first sacrificial layer 109 isalso provided for defining the diameter of the membrane, such that thesize of the membrane can be determined in advance based on the size ofthe first sacrificial layer, rather than being based on an etchingprocess that is carried out when forming the back-volume from underneaththe wafer.

In FIG. 7 a diaphragm layer, for example a silicon nitride diaphragmlayer 111, is deposited over the silicon nitride dielectric layer 107and the first sacrificial layer 109. Part of the silicon nitridediaphragm layer 111 is used in the formation of the membrane of themicrophone (i.e. the membrane 11 in FIG. 2). The silicon nitridediaphragm layer 111 can be deposited using a PECVD process at 30020 C.,with Silane (SiH₄), Ammonia (NH₃) and nitrogen (N₂) having respectiveflow rates of 40, 40 and 1400 sccm (standard cubic centimetres/minute).The RF power can be 20 W and can be alternated every 6 seconds between ahigh frequency (13.56 MHz) and a low frequency (400 kHz). The siliconnitride diaphragm layer 111 has a thickness, for example of between 0.38um to 0.42 um, for example 0.4 um, and a tensile stress of between 40 to50 MPa, for example 45 MPa.

Although not shown in FIGS. 6 a and 7 a, the upper surface of the firstsacrificial layer 109 may be formed with one or more dimples (in theform of small cavities) in its outer area (i.e. near the periphery ofthe first sacrificial layer 109). As a result, the depositing of thesilicon nitride diaphragm layer 111 causes one or more dimples (in theform of protrusions) to be formed in the outer area or periphery of themembrane. These dimples in the outer area of the membrane 11 reduce thecontact area of the membrane with the underlying substrate. Thisprevents the membrane from sticking to the area shown in the “dog-leg”formed by the first cavity 9 in FIG. 2, i.e. in the area away from theopening formed by the back-volume. The dimples reduce the stictionforces such that they are below the restoring forces (i.e. the membranetension), thereby allowing the membrane to release itself.

It is noted that the membrane 11 may be formed from materials other thansilicon nitride. For example, the membrane may also be polysilicon.Alternatively, the membrane may be part of a sandwich structurecomprising metal/nitride/metal or nitride/metal/nitride. For example, acomposite stack could be formed from aluminium/silicon nitride/aluminium(having thicknesses, for example, of 50 nm/400 nm/50 nm). Alternatively,the metal layer may be buried in a composite stack formed from siliconnitride/aluminium/silicon nitride (having thicknesses, for example, of200 nm/50 nm/200 nm). In addition, titanium adhesive layers may be usedbetween the aluminium and the silicon nitride. The formation of asandwich structure has the advantage of reducing unwanted deformation inthe membrane. In other words, if the electrode is placed between twolayers of nitride, or vice versa, then the stress is more equalised, andresults in the membrane moving with less unwanted deformation.

Next, referring to FIG. 8 a, a first electrode 113 is formed bydepositing or sputtering a conducting material, for example aluminium,on the silicon nitride diaphragm layer 111. Preferably the firstelectrode 113 has a thickness in the range 0.04 um to 0.06 um, forexample 0.05 um, and a tensile stress of between 175 to 225 MPa, forexample 200 MPa. It is noted that these thicknesses and stress valuesare based on the first electrode being made from aluminium, and thatother thicknesses and stress values may apply from electrodes made fromother materials. Depositing the first electrode 113 by sputtering ispreferable to other methods such as thermal evaporation due to the lowsubstrate temperatures used. This ensures compatibility with CMOSfabrication processes. In addition, where materials other than aluminiumare deposited, this method benefits from the ability to accuratelycontrol the composition of the thin film that is deposited. Sputteringdeposits material equally over all surfaces so the deposited thin filmhas to be patterned by resist application and dry etching with aCl₂/BCl₃ gas mix to define the shape of the lower electrode 15 as wellas to define the interconnect points 114 b that allow interconnection tothe circuit regions (i.e. either the underlying CMOS circuit or theoff-chip circuits).

As can be seen from FIG. 8 a, the first electrode 113 does not cover thewhole diameter of the membrane 111 as the outer areas of the membrane111 suffer less movement and thus contribute to a relatively fixedcapacitance. Thus, according to this aspect of the invention thediameter of the first electrode 113 is different to the diameter of themembrane 111. For example, the diameter of the first electrode 113 maybe between 50% to 70% of the diameter of the membrane 111. However, aperson skilled in the art will realise that other values may be used.For example, the first electrode may be less than 90% of the diameter ofthe membrane; less than 80% of the diameter of the membrane, or anyother value.

Although the material for the first electrode 113 in the preferredembodiment is aluminium, a person skilled in the art will realise thatthe first electrode 113 may comprise any other conductive material e.g.AlSi, AlSiCu, Ti, TiW, Cu, Ni, NiCr, Cr, Pt, Ta or Pd suitable for useas the electrode material.

A perspective view of the first electrode 113 is shown in FIG. 8 b,which shows how the first electrode 113 has an associated track 114 aand pad 114 b for interconnecting the first electrode 113 to othercircuitry, either on the same substrate or a different integratedcircuit. The track 114 a is not shown in FIG. 8 a due to the nature ofthe cross-section taken. It will be appreciated that other electrodematerials or electrode stacks may be used to minimize stress. Forexample, an electrode stack may comprise a titanium adhesive layer andan aluminium conductor.

In FIG. 9 a plurality of openings or bleed holes 115 are formed in thediaphragm region of the silicon nitride diaphragm layer 111. The bleedholes 115 may be formed by etching the holes in the silicon nitridediaphragm layer 111. The bleed holes 115 may be about 2 um in diameter,for example. As an alternative to forming the bleed holes 115 after theformation of the first electrode 113, it is noted that the bleed holes115 could also be formed immediately after the step of forming thesilicon nitride diaphragm layer 111, and before forming the firstelectrode 113. The bleed holes 115 are arranged such that an area etchedthrough a first bleed hole 115 substantially overlaps an area etchedthrough an adjacent bleed hole. The bleed holes may have a spacing ofless than 100 um. Further details regarding the positioning of the bleedholes will be discussed below in relation to FIGS. 21 a, 21 b and 22 c.

In FIG. 10 a a second sacrificial layer 117, preferably a polyimidelayer the same as or similar to the first sacrificial layer 109, isdeposited over the silicon nitride diaphragm layer 111, such that thesecond sacrificial layer 117 covers the first electrode 113 and thebleed holes 115. The second sacrificial layer 117 defines the dimensionsand shape of the cavity above the membrane (i.e. the second cavity 17 inFIG. 2) that will be left when the second sacrificial layer 117 isremoved as discussed below. The second sacrificial layer 117 has athickness, for example, of between 2.1 um to 2.3 um, for example 2.2 um.Although the second sacrificial layer 117 is shown as havingapproximately the same dimensions as the first sacrificial layer 109, itis noted that the first and second sacrificial layers 109, 117 may havedifferent dimensions, for example different thicknesses and/or differentdiameters. FIG. 10 b shows a perspective view of the device with thesecond sacrificial layer 117 added.

FIG. 11 shows how a plurality of dimples 119 (in the form of smallcavities) may be formed in the surface of the second sacrificial layer117. The dimples 119 may be 200 nm deep, for example. Although notessential, the dimples 119 reduce the contact area in the event ofover-pressure or membrane pull-in, whereby the surface of the membranecomes in contact with another surface of the MEMS device. The dimples119 reduce the stiction forces such that they are below the restoringforces (i.e. the membrane tension), thereby allowing the membrane torelease itself.

A back-plate for supporting a second electrode is then formed by firstdepositing a lower silicon nitride back-plate layer 121 as shown in FIG.12 a. The lower silicon nitride back-plate layer 121 can be depositedusing the PECVD process at 300° C. as described above. The lower siliconnitride back-plate layer 121 has a thickness, for example, of between0.28 um to 0.32 um, for example 0.3 um, and a tensile stress of between50 to 200 MPa, for example 100 MPa. FIG. 12 b shows a perspective viewof the device with the silicon nitride back-plate layer 121 added.

The second electrode 123 is then formed as shown in FIG. 13 a, bydepositing a conducting layer, for example aluminium, on the lowersilicon nitride back-plate layer 121. The second electrode 123 has athickness, for example, of between 0.09 um and 0.11 um, for example 0.1um. FIG. 13 b shows a perspective view of the second electrode 123 andits associate track 124 a and pad 124 b for connection to other circuitcomponents. It will be appreciated that the track 124 a is not shown inFIG. 13 a due to the nature of the cross-section taken. As can be seenfrom FIG. 13 a, the second electrode 123 is approximately the samediameter as the first electrode 113. As such, the diameter of the secondelectrode 123 is different to the diameter of the membrane 111. Furtherdetails about this aspect of the invention, including further aspectsrelating to the shape and size of the second electrode 123, will bedescribed later in the application with reference to FIG. 20.

As with the first electrode 113, the material for the second electrode123 may comprise any conductive material e.g. Al, AlSi, AlSiCu, Ti, TiW,Cu, Ni, NiCr, Cr, Pt, Ta or Pd suitable for use as the electrodematerial.

Next, in FIG. 14, the remainder of the back-plate is formed bydepositing an upper silicon nitride back-plate layer 125. As above, theupper silicon nitride back-plate layer 125 can be deposited using aPECVD process at 300° C. The upper silicon nitride back-plate layer 125has a thickness, for example, of between 2.1 um to 2.3 um, for example2.2 um, and a tensile stress of between 125 to 175 MPa, for example 150MPa.

The lower and upper silicon nitride back-plate layers 121, 125 definethe structurally rigid back-plate 14 of FIG. 2 that supports the secondelectrode 123. The back-plate is configured to have a greater measure ofstiffness than the membrane, for example a measure of stiffness that isten times greater than that of the membrane. It will be appreciated thatreferences to the back-plate 14 having a greater measure of stiffnessthan the membrane is intended to include a combination of thickness andstress, i.e. in addition to stress per se.

In FIG. 15, pad connection holes 127 are etched in the upper siliconnitride layer 125 to provide connectivity to pads of the electrodetracks of the first and second electrodes 113, 123. Additional holes mayalso be etched at this stage, for example to provide connectivity to thesilicon substrate 101, or other regions of the MEMS device.

Next, in FIG. 16 a, a pad thickening mask 129 is applied, for exampleusing a Ti/Al deposition having a thickness of between 0.95 um to 1.05um, for example 1 um. The titanium is used for adhesion purposes. Thisinvolves first depositing a titanium layer of 50 nm, for example, andthen the remainder of the aluminium. FIG. 16 b shows a perspective viewof FIG. 16 a. The pad thickening mask 129 is applied to improve thestrength of the respective pads.

As shown in FIG. 17 a, a plurality of acoustic holes 131 are then formedin the upper silicon nitride back-plate layer 125. The acoustic holes131 extend to the second sacrificial layer 117. When using a secondelectrode as shown in FIGS. 13 a and 13 b, this involves the step ofetching though the upper silicon nitride back-plate layer 125 and secondelectrode 123 in the region of the second electrode 123. However, aswill be appreciated from the further discussions of the second electrode123 below, the etching of the second electrode 123 can be avoided atthis stage when the electrode is formed with pre-existing holes, asdiscussed with reference FIG. 20.

During the fabrication process the acoustic holes 131 allow the secondsacrificial layer 117 (and parts of the first sacrificial layer 109through the bleed holes 115) to be etched from above the wafer. Duringuse of the microphone device, i.e. after the removal of the sacrificiallayers, the acoustic holes 131 allow sound waves to pass to themembrane.

The acoustic holes 131 have a diameter, for example, of about 5 um, anda spacing, for example, of about 15 um. FIG. 17 b shows a perspectiveview of the arrangement of the acoustic holes 131. It will beappreciated that either fewer or additional holes may be provided.

Referring to FIG. 18 a a back-volume 133 is then formed by etching fromunderneath the substrate. The etching may be performed using a wet-etchup to the silicon nitride dielectric layer 107 which acts as a firstetch stop. The wet etch involves patterning the back of the wafer withresist, and this pattern is then transferred to the silicon nitridedielectric layer 107 on the back of the wafer and which is not attackedby the wet etch chemical. The mask pattern will typically be square andaligned to the wafer crystal planes. The wet etch is performed using anaqueous solution of 22% tetramethylammonium hydroxide (TMAH) and 78%water and results in a smaller but square opening at the membrane. Aperson skilled in the art will also appreciate that the wet etch processcould be performed with Potassium Hydroxide. A further etch is thenperformed through the silicon nitride dielectric layer 107 to the firstsacrificial layer 109 which acts as a polyimide etch stop.

Once the back-volume 133 has been etched as described above, the innerarea of the first sacrificial layer 109 may then be etched from belowthe wafer, i.e. in a direction away from the substrate and towards thefirst sacrificial layer 109, as shown in FIG. 18 b. The inner area ofthe first sacrificial layer 109 corresponds to the pattern transferredto the silicon nitride dielectric layer 107. The area of the back volume133 in a plane where the back volume 133 meets the first sacrificiallayer 109 is smaller than the area of the first sacrificial layer 109 atsaid plane. As will be appreciated by a person skilled in the art, theprocess of etching a back-volume 133 of this size leads to a naturaltapering in the back-volume (i.e. the square shape of the mask patternbecomes smaller as the etch moves towards the etch-stop, therebycreating a pyramid shape). However, as mentioned above, since thediameter of the membrane is effectively defined by the outer diameter offirst sacrificial layer 109 (in conjunction with the outer diameter ofthe second sacrificial layer 117), the degree to which the back-volumetapers during the wet etch process is irrelevant, since the area of theback-volume near the point where the back-volume meets the firstsacrificial layer 109, i.e. near point 135 in FIG. 18, does notcontribute to the definition of the diameter of the membrane. Instead,the diameter of the membrane is defined by the subsequent removal of theremaining portions, i.e. outer area, of the first sacrificial layer 109.This is described in relation to FIG. 19 below.

As an alternative to the wet etch process, a dry etch may be used toform the back-volume 133, whereby the substrate is patterned withrelatively thick (8 um) resist and dry etched using a SF₆/C₄F₈ gascombination in a reactive ion etch using a Surface Technology SystemsInductively Coupled Plasma (STS ICP) machine. The dry etch can be usedto provide a back-volume having a diameter, for example, of about 900nm. Although not as significant as the tapering of the wet etch process,the dry etch process also exhibits a reduction in the diameter of theback-volume as it extends through the substrate, and through the siliconnitride dielectric layer 107 towards the first sacrificial layer 109.However, as mentioned above, since the diameter of the membrane iseffectively defined by the outer diameter of first sacrificial layer109, the degree to which the back-volume tapers during the dry etchprocess is irrelevant, since the diameter of the back-volume near thepoint where the back-volume meets the first sacrificial layer 109, i.e.near point 135 in FIG. 18 a, does not define the diameter of themembrane. Instead, the diameter of the membrane is defined by thesubsequent removal of the remaining portions, i.e. outer area, of thefirst sacrificial layer 109 as described below.

In order to protect the wafer during the etching processes describedabove, and in particular the wet etch process, a protective layer (notshown) may be placed over the upper silicon nitride back-plate layer 125prior to performing the back-etching. The protective layer acts toprotect the front side of the wafer during the back-etch process. Aswell as protecting the wafer from damage during the back-etch process,the protective layer also prevents the acoustic holes 131 from beingclogged by any debris that might be produced during a singulationprocess (also described below).

Once the back-volume has been etched as described in FIG. 18 a above,and the inner area of the first sacrificial layer 109 etched asdescribed in FIG. 18 b, the remainder (i.e. outer area) of the firstsacrificial layer 109 and the whole of the second sacrificial layer 117may then be removed by performing a front-etch, i.e. from above thewafer.

However, prior to removal of the remainder of the first sacrificiallayer 109 and the whole of the second sacrificial layer 117 in this way,the wafer is first placed on a carrier, for example dicing tape, forsingulation. Other carriers may also be used, for example a glasscarrier in combination with adhesive tape.

When the MEMS microphones are formed in large numbers on a substrate,i.e. wafer, the substrate containing the MEMS microphones is diced up sothat there is only one device (or a functional group of devices) perdiced piece, in a process known as singulation. Note that in thiscontext a device comprises one or more MEMS transducer (and possiblycircuit regions) as described above. This embodiment of the method isadvantageous in that the second sacrificial layer 117 and remainder ofthe first sacrificial layer 109 provide mechanical support for thedelicate membrane structures during singulation. The protective layerprevents the acoustic holes 131 from being clogged or damaged by anydebris that may be produced during the singulation process.

The method of singulating the substrate can be one of the following:dicing with a high speed diamond blade; laser cutting; or scribing thesubstrate and cleaving the substrate along a crystallographicorientation. The substrate is typically attached to a high temperaturedicing tape. The dicing tape may be any adhesive tape suitable tosurvive the process in which the second sacrificial layer 117 andremainder of the first sacrificial layer 109 are removed. Duringsingulation, the intact second sacrificial layer 117 (and outer portionsof the first sacrificial layer 109) provide strength and protection tothe membrane, while the protective layer prevents the acoustic holes 131from becoming clogged by debris resulting from the singulation process.After singulation, there is only one device per diced piece, or multipledevices when producing device arrays.

The singulated substrate, still on the dicing tape, is processed using adry etch process from above the wafer (for example an oxygen plasmasystem) to remove the protective layer, the second sacrificial layer 117and the remaining portions of the first sacrificial layer 109. Forexample, an oxygen plasma introduced through the acoustic holes 131 willetch through to the second sacrificial layer 117, and also through thebleed holes 115 to remove the remaining sections of the firstsacrificial layer 109. During this process oxygen is introduced into achamber in which the substrate is placed and a plasma set up. The oxygenin the plasma reacts with the organic sacrificial layer to form volatileoxides which can then be removed from the chamber.

Typically the conditions used for this process are a temperature of15020 C. in an oxygen plasma for approximately 3 hours (40% O₂,radiofrequency power 350 W, magnetic field 660 mT). However, a personskilled in the art will appreciate that any conditions suitable toremove the polyimide sacrificial layers may be envisaged.

Therefore, as will be appreciated from the above, the bleed holes 115aid with the removal of the first sacrificial layer 109 during thefabrication process. In addition, the bleed holes 115 allow a restrictedair flow to pass between the cavity created by the second sacrificiallayer 117 and the cavity created by the first sacrificial layer 109 andthe back-volume 133. This results in an improved performance at lowfrequency.

According to another aspect of the invention, the individual devices canbe tested while they are still on the dicing tape, but after they havebeen singulated, and after the sacrificial layers have been removed.This enables the substrates to be tested in mass production, rather thanhaving to mount each individual device into a carrier for testing.

The finished MEMS microphones are removed from the dicing tape andmounted in a package (not shown). This may be achieved using anautomated pick and place system that lifts a microphone chip from thedicing tape and places it in the package suitable for electricalconnection to any device operable to interface with the microphone.

In addition to the process and sequence described above for removing thefirst and second sacrificial layers, it is noted that other processesand sequences may also be adopted within the scope of the invention.

For example, the wafer may be placed on a dicing tape after the processof etching the back-volume 133 as described in FIG. 18 a, but beforeremoving any of the first sacrificial layer 109. The wafer may then besingulated with both the first and second sacrificial layers 109, 117intact. The first and second sacrificial layers 109, 117 may then beremoved by etching from above the wafer, i.e. through the acoustic holes131, the second sacrificial layer 117, the bleed holes 115 and finallythe first sacrificial layer 109. Alternatively, the dicing tape can beperforated such that the inner portion of the first sacrificial layer109 is etched from below the wafer (as described in FIG. 18 b), with thesecond sacrificial layer 117 and the outer area of the first sacrificiallayer 117 being etched from above the wafer (i.e. as described in FIG.19).

As an alternative to perforating a dicing tape, the carrier may comprisea glass carrier or a silicon wafer carrier having predefined channels,trenches, protrusions or other structures for allowing the sacrificiallayer to be etched from underneath via the back volume after beingplaced on the carrier. In other words, according to this arrangement thepredefined channels, trenches, protrusions or other structures enablethe etch material or gas to access the back volume, and hence the innerarea of the first sacrificial layer. As an alternative, or in additionto the carrier having such channels, trenches, protrusions or otherstructures, it is noted that these could also be placed on the substrateitself for allowing the etch material or gas to access the back volumewhile the substrate is located on the carrier.

The invention also encompasses the first and second sacrificial layersbeing removed by etching both the first and second sacrificial layersfrom below the wafer, i.e. in a direction from the substrate towards thefirst sacrificial layer 109. In such an arrangement the secondsacrificial layer is etched via the back volume 133 and bleed holes 115.

According to another aspect of the present invention as shown in FIG.20, the second electrode 123 may be deposited with a predeterminedpattern. The predetermined pattern may comprise one or more openings orholes corresponding to the position of one or more openings in theback-plate i.e. the acoustic holes 131 for enabling sound waves to passto the second cavity 17 of FIG. 2. In other words, by forming the secondelectrode using a predetermined pattern, the etching process describedin FIG. 17 a for forming the acoustic holes 131 only needs to etchthrough silicon nitride, rather than through silicon nitride and thesecond electrode. This simplifies the etching process. Furthermore, thediameter of the preformed holes in the electrode can be made larger thanthe diameter of the acoustic holes. This has the advantage ofencapsulating the second electrode, and hence protecting the device frommoisture during use. It is noted that the electrode coupled to themembrane may also be encapsulated in a similar manner for protectionduring use. In other words, if the membrane comprises a sandwichedelectrode, with the membrane having one or more holes corresponding toone or more holes in the sandwiched electrode, at least one of the holesin the electrode can be made larger than a corresponding holes in themembrane, thus encapsulating the electrode.

FIGS. 21 a, 21 b and 21 c illustrate in greater detail the arrangementof the bleed holes 115, and in particular the positioning of the bleedholes 115 in relation to the boundary or outer perimeter of the firstsacrificial layer 109 and the back volume 133. FIG. 21 a shows a MEMSdevice having 64 bleed holes, FIG. 21 b a MEMS device having 120 bleedholes, and FIG. 21 c a MEMS device having 136 bleed holes. Referring toFIG. 21 a, the bleed holes 212 are arranged on first and secondconcentric circles near the periphery 210 of the first sacrificiallayer. Each of the bleed holes 212 etches an area 211. The bleed holes212 are arranged such that the areas 211 overlap one another, therebyenabling the outer area of the sacrificial layer to be etched away. Thelines 213 represent the area of the back volume at the plane where theback volume meets the first sacrificial layer. The lines 213 representthe margin of error that is introduced by the back-etch process. Theback-volume shown in FIG. 21 a (i.e. having a substantially squarecross-section) is formed from a wet-etch process. It will be appreciatedthat a back-volume produced using a dry-etch process will result in agenerally circular area.

FIG. 21 b shows 120 bleed holes 212 arranged on three concentriccircles, while FIG. 21 c shows 136 bleed holes 212 arranged in threeconcentric circles.

It is noted that the precise number and positioning of the bleed holes212 is selected in order to tune the operating characteristics of thedevice, for example the low frequency response of the device. There is atrade off between too many holes affecting the low frequency roll-off,and too few holes preventing a proper etching process. In addition, itis noted that the performance of the device may be tuned according tothe electronic circuitry that interfaces with the device, or vice versa.

According to a further aspect of the invention, although the firstelectrode 113 is shown as being deposited on top of the membrane, i.e.the silicon nitride diaphragm layer 111, the first electrode 113 mayalso form an integral part of the membrane, or be located on theunderside of the membrane. Such arrangements prevent deformation of themembrane.

It is noted that the problem of reducing the temperature dependence andincreasing the sensitivity of a MEMS microphone is addressed in theexemplary embodiment by carefully controlling the stress in the membraneand closely matching the combined thermal expansion coefficient of themembrane and the first electrode with that of silicon. This is describedin further detail in co-pending PCT application PCT-06-019. This is donebecause differences in the thermal coefficient of expansion of themembrane and the substrate give rise to a temperature dependent stressin the membrane. As the sensitivity of the device is inverselyproportional to membrane stress, the sensitivity can be maximized bychoosing a relatively low membrane stress. However, in previously knowndevices a small change in temperature can result in a large change insensitivity or the membrane tension may be completely released thusrendering the device useless. The membrane structure of the firstembodiment seeks to address this problem.

Firstly, process parameters for deposition of the silicon nitridediaphragm layer 111 are carefully chosen to control its resultantstress. Aluminium is deposited and patterned to form the resultant firstelectrode 113 structure. The process parameters are chosen to controlthe tensile stress of the deposited membrane 111 so that the tensilestress is in the range 40-50 MPa. As the silicon substrate has a thermalexpansion coefficient which is typically greater than that of thesilicon nitride, the tension of the membrane increases with an increasein temperature for a silicon nitride membrane in the absence of adeposited electrode. In contrast, aluminium and other candidateelectrode materials exhibit a higher thermal expansion coefficient thansilicon. The exemplary embodiment thus uses a composite membrane inwhich the combined thermal expansion coefficient of the membrane plusthe electrode is more closely matched to the thermal expansioncoefficient of silicon. Typical material properties for the preferredmaterials are listed in table 1 from P.R. Scheeper, “A silicon condensermicrophone: materials and technology”, ISBN 90-9005899-0, pg. 54. TABLE1 Expansion coefficient (×10⁻⁶/° C.) Young's Modulus E (GPa) Silicon 3.2180 Silicon Nitride 1.5 110 Aluminium 24.5 70

To estimate the respective thickness of the membrane 111 and the firstelectrode 113 an approximation to the thickness ratio of aluminium(t_(al)) to silicon nitride (t_(sn)) can be found to be given by$\frac{t_{al}}{t_{sn}} \approx \frac{( {E_{sn}/( {1 - v_{sn}} )} )( {\alpha_{sn} - \alpha_{si}} )}{( {E_{al}/( {1 - v_{al}} )} )( {\alpha_{si} - \alpha_{al}} )}$Here, t is the thickness of the structural element, E is Young'smodulus, α is the thermal expansion coefficient, ν is Poisson's ratioand the subscripts al, sn and si denote the materials used in thisexample i.e. aluminium, silicon nitride and silicon respectively. Thisimplies that the first electrode 113 thickness should be approximately aseventh of the silicon nitride membrane 111 thickness. A more accurateestimation is obtained using numerical simulation taking into accountthe electrode area and the respective Poisson's ratio of each of thematerials. As exact material parameters can depend on the specificprocessing conditions, these are thus determined experimentally. Toavoid bowing due to differential layer stresses a sandwich of eithermetal/nitride/metal or nitride/metal/nitride can also be employed. Inorder to ensure optimum sensitivity in the exemplary embodiment, theback plate is typically more than ten times stiffer than the membrane111. To avoid the back-plate becoming too thick, the back-plate may befabricated with a higher stress than that of the membrane 111.

Although not shown in the embodiments above, the sensitivity of themicrophone may be rendered relatively independent of changes intemperature by the addition of controlled stress release structures thatare etched in the region of the outer perimeter of a membrane, asdescribed in co-pending PCT application PCT-07-019. The controlledstress release structures effectively reduce the Young's modulus of thisregion.

Furthermore, the membrane may be attached to a structurally strong backplate which is itself stress decoupled from the substrate, which is alsodescribed in further detail in co-pending PCT application PCT-07-019.

A person skilled in the art will appreciate that the above descriptionof the preferred embodiment is not limited to the fabrication of MEMSmicrophones. For example, the method described in the embodiment may bemodified so that the step of etching a hole in the underside of thesubstrate is omitted (or reduced) from the process so as to fabricate anultrasonic transducer. This could involve making the back-plate thinnersuch that it becomes moveable by applying a voltage across the twoelectrodes. Re-sealing of the holes would allow operation also as animmersion transducer. Again without the back-volume and with a re-sealedmembrane the capacitance will become sensitive to absolute pressurerather than differential pressure. Furthermore, the method described inthe embodiment above may be used to fabricate a pressure sensor orfabricate an array on a substrate, the array comprising any or all of: amicrophone; an ultrasonic transducer; and a pressure sensor. The array,combined with appropriate electronics and signal processing couldprovide a directionally selective microphone.

The invention is also applicable to other MEMS transducers, such asaccelerometers having a mass located on the membrane.

Although the embodiments have been described in relation to the membranemoving in response to pressure differences, and in particular pressuredifferences caused by sound waves, the membrane may also be configuredto move in response to absolute pressure.

It is also noted that although the embodiments described above are inrelation to the sacrificial material being a polyimide, it is noted thatthe sacrificial material may include other organic materials including,but not limited to, polyacrylate, polyamide, polycarbonate andpolyethylene terapthalate. The first and second sacrificial layers mayalso be made from different materials.

In addition, it will be appreciated that the deposition of the variouslayers may be made in a different sequence, or in a different order. Forexample, the first electrode may be deposited on the underside of themembrane, rather than above the membrane as shown in the embodiment.Also, the first sacrificial layer may be formed by etching a recess inthe silicon nitride layer, and depositing the sacrificial layer in therecess (i.e. as opposed to depositing the first sacrificial layer on topof the silicon nitride layer). Furthermore, it is noted that one or morelayers may be omitted from the process.

Additional layers may also be incorporated, for example an environmentalbarrier may be provided for preventing moisture or other unwantedmaterials from entering the device.

Furthermore, other forms of wet and dry etch processes may be used asalternatives to the processes described above. For example, the plasmaoxygen may be mixed with one or more of the following gases: SF6, CF4,CH2F2, H2, Ar, C4F8, C2F6, CFH3.

It is noted that the invention may be used in a number of applications.These include, but are not limited to, consumer applications, medicalapplications, industrial applications and automotive applications. Forexample, typical consumer applications include laptops, mobile phones,PDAs and personal computers. Typical medical applications includehearing aids. Typical industrial applications include active noisecancellation. Typical automotive applications include hands-free sets,acoustic crash sensors and active noise cancellation.

It should be noted that the above-mentioned embodiments illustraterather than limit the invention, and that those skilled in the art willbe able to design many alternative embodiments without departing fromthe scope of the appended claims. The word “comprising” does not excludethe presence of elements or steps other than those listed in a claim,“a” or “an” does not exclude a plurality, and a single feature or otherunit may fulfill the functions of several units recited in the claims.Any reference signs in the claims shall not be construed so as to limittheir scope.

This application claims priority to United Kingdom Application No.0605576.8, filed Mar. 20, 2006, the entire disclosure of which isincorporated herein by reference.

1. A method of fabricating a micro-electrical-mechanical system (MEMS)transducer on a substrate, the method comprising: depositing a firstsacrificial layer with respect to a first side of a membrane; depositinga second sacrificial layer with respect to a second side of themembrane; and removing the first and second sacrificial layers so as toform a MEMS transducer in which the membrane is moveable.
 2. A method asclaimed in claim 1, wherein the membrane is configured to be moveable inresponse to pressure.
 3. A method as claimed in claim 2, wherein themembrane is configured to be moveable in response to absolute pressure.4. A method as claimed in claim 2, wherein the membrane is configured tobe moveable in response to differential pressure.
 5. A method as claimedin claim 4, wherein the membrane is configured to be moveable inresponse to pressure differences generated by sound waves.
 6. A methodas claimed in claim 4, wherein the transducer is a microphone.
 7. Amethod of fabricating a micro-electrical-mechanical system (MEMS)microphone on a substrate, the method comprising: depositing first andsecond electrodes; depositing a membrane, the membrane beingmechanically coupled to the first electrode; and depositing a backplate, the back plate being mechanically coupled to the secondelectrode; wherein the step of depositing the membrane further comprisesthe step of depositing the membrane on a first sacrificial layer; andwherein the method further comprises the steps of: depositing a secondsacrificial layer in an area between the first and second electrodes;and removing the first and second sacrificial layers so as to form aMEMS microphone having a first cavity beneath the membrane, and a secondcavity between the first and second electrodes, such that the membraneand the first electrode are able to move relative to the secondelectrode.
 8. A method as claimed in claim 7 further comprising the stepof forming a third cavity, the third cavity connecting with the firstcavity to form a back volume.
 9. A method as claimed in claim 7, furthercomprising the step of forming the first sacrificial layer on at leastone structural layer, the at least one structural layer being positionedbetween the membrane and the substrate.
 10. A method as claimed in claim9, wherein the step of forming the third cavity comprises the step ofetching the substrate and the at least one structural layer, and whereinthe first sacrificial layer acts as an etch stop for the third cavity.11. A method as claimed in claim 9, wherein the third cavity is formedsuch that the area of the third cavity at a plane where the third cavitymeets the first sacrificial layer is smaller than the area of the firstsacrificial layer, such that the area of the third cavity in said planefalls substantially within the perimeter of the first sacrificial layer.12. A method as claimed in claims 8, wherein the third cavity is formedusing a dry etch process.
 13. A method as claimed in claim 8, whereinthe third cavity is formed using a wet etch process.
 14. A method asclaimed in any one of claim 7, further comprising the step of forming aplurality of openings through the membrane material between the firstsacrificial layer and the second sacrificial layer.
 15. A method asclaimed in claim 14, wherein the step of forming the plurality ofopenings comprises the steps of: etching a plurality of holes in thematerial of the membrane; and depositing the second sacrificial layerover the membrane and the holes etched in the material of the membrane,such that the second sacrificial layer fills the holes etched in thematerial of the membrane.
 16. A method as claimed in claim 14, whereinsaid openings are positioned in an outer area of the first sacrificiallayer, the outer area of the first sacrificial layer being outside thearea defined by the third cavity at the plane where the third cavitymeets the first sacrificial layer.
 17. A method as claimed in any one ofclaim 14, wherein the plurality of openings are arranged such that anarea etched through a first opening substantially overlaps an areaetched through an adjacent opening.
 18. A method as claimed in claim 17,wherein the openings having a spacing of less than 100 um.
 19. A methodas claimed in claim 16, wherein said openings are formed on one or moreconcentric circles in the outer area of the first sacrificial layer. 20.A method as claimed in 7, wherein the step of removing the first andsecond sacrificial layers comprises: removing an inner area of the firstsacrificial layer; removing the second sacrificial layer; and removingan outer area of the first sacrificial layer.
 21. A method as claimed inclaim 20, wherein the step of removing the second sacrificial layer andthe step of removing the outer area of the first sacrificial layer areperformed separately.
 22. A method as claimed in claim 20 comprising:removing the inner area of the first sacrificial layer by etching in afirst direction, the first direction being from the substrate sidetowards the first sacrificial layer; and removing the second sacrificiallayer and the outer area of the first sacrificial layer by etching in asecond direction, the second direction being from the back plate sidetowards the second sacrificial layer.
 23. A method as claimed in claim7, wherein the step of removing the first and second sacrificial layerscomprises the steps of: removing the first sacrificial layer; andsubsequently removing the second sacrificial layer.
 24. A method asclaimed in claim 23 wherein the first and second sacrificial layers areremoved by etching in a first direction, the first direction being fromthe substrate side towards the first sacrificial layer.
 25. A method asclaimed in any one of claim 7, wherein the step of removing the firstand second sacrificial layers comprises the steps of: removing thesecond sacrificial layer; and subsequently removing the firstsacrificial layer.
 26. A method as claimed in claim 25 wherein the firstand second sacrificial layers are removed by etching in a seconddirection, the second direction being from the back plate side towardsthe second sacrificial layer.
 27. A method as claimed in any one ofclaim 7, comprising forming a plurality of MEMS microphones on a wafer.28. A method as claimed in claim 27 further comprising the steps of:placing the wafer on a carrier between the step of removing the innerportion of the first sacrificial layer and the step of removing thesecond sacrificial layer and the outer area of the first sacrificiallayer; and singulating the wafer prior to the step of removing thesecond sacrificial layer and the outer area of the first sacrificiallayer.
 29. A method as claimed in claim 27, further comprising the stepsof: placing the wafer on a carrier prior to the step of removing theinner portion of the first sacrificial layer; and singulating the waferprior to the step of removing the second sacrificial layer and the outerarea of the first sacrificial layer.
 30. A method as claimed in claim29, further comprising the step of perforating the carrier prior to thestep of removing the inner portion of the first sacrificial layer.
 31. Amethod as claimed in claim 29, wherein the carrier is configured toallow the inner portion of the first sacrificial layer to be etched viathe back volume while located on the carrier.
 32. A method as claimed inclaim 31, wherein the carrier comprises one or more channels or trenchesor protrusions for allowing the inner portion of the first sacrificiallayer to be etched via the back volume while located on the carrier. 33.A method as claimed in claim 29, wherein the substrate is configured toallow the inner portion of the first sacrificial layer to be etched viathe back volume while located on the carrier.
 34. A method as claimed inclaim 33, wherein the substrate comprises one or more channels ortrenches or protrusions for allowing the inner portion of the firstsacrificial layer to be etched via the back volume while located on thecarrier.
 35. A method as claimed in claim 28, wherein the step ofsingulating comprises cutting the substrate using a saw.
 36. A method asclaimed in claim 28, wherein the step of singulating comprises scribingand cleaving the substrate.
 37. A method as claimed in claim 28, whereinthe step of singulating comprises cutting the substrate using a laser.38. A method as claimed in claim 28, wherein the carrier is a dicingtape.
 39. A method as claimed in claim 38, wherein the dicing tape isable to sustain temperatures that are higher than the temperature of theprocess for removing the sacrificial layers.
 40. A method as claimed inclaim 31, wherein the carrier is made from glass or silicon wafer.
 41. Amethod as claimed in 7, further comprising the step of forming aplurality of openings in the back plate.
 42. A method as claimed inclaim 41, further comprising the step of depositing a protective layeron the back plate.
 43. A method as claimed in claim 1, wherein at leastone of the sacrificial layers comprises an organic material.
 44. Amethod as claimed in claim 43, wherein at least one of the sacrificiallayers is a polyacrylate, a polyimide, a polyamide, a polycarbonate, ora polyethylene terapthalate.
 45. A method as claimed in claim 1, whereinthe steps of removing the first and/or second sacrificial layerscomprises using a dry etch process.
 46. A method as claimed in claim 45,wherein the step of removing the first and/or second sacrificial layerscomprises using a plasma oxygen etch process.
 47. A method as claimed inclaim 46, wherein the plasma oxygen is mixed with one or more of thefollowing gases: SF6, CF4, CH2F2, H2, Ar, C4F8, C2F6, CFH3.
 48. Amicro-electrical-mechanical system (MEMS) capacitive microphonecomprising: first and second electrodes; a membrane that it ismechanically coupled to the first electrode; and a back plate that it ismechanically coupled to the second electrode; wherein the first andsecond electrodes each have a diameter that is different to the diameterof the membrane.
 49. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 48, wherein the diameters of the firstand second electrodes are smaller than the diameter of the membrane. 50.A micro-electrical-mechanical system (MEMS) microphone as claimed inclaim 49, wherein the diameters of the first and second electrodes areless than 90% of the diameter of the membrane.
 51. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim49, wherein the diameters of the first and second electrodes are lessthan 80% of the diameter of the membrane.
 52. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim49, wherein the diameters of the first and second electrodes are between50-70% of the diameter of the membrane.
 53. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim48, wherein the diameters of the first and second electrodes aresubstantially equal.
 54. A micro-electrical-mechanical system (MEMS)capacitive microphone comprising: first and second electrodes; amembrane that it is mechanically coupled to the first electrode; and aback plate that it is mechanically coupled to the second electrode;wherein the second electrode comprises one or more openings.
 55. Amicro-electrical-mechanical system (MEMS) capacitive microphone asclaimed in claim 54, wherein the one or more openings correspond to oneor more openings formed in the back plate.
 56. Amicro-electrical-mechanical system (MEMS) capacitive microphone asclaimed in claim 55, wherein at least one of the openings in the secondelectrode is larger than a corresponding opening in the back plate. 57.A micro-electrical-mechanical system (MEMS) capacitive microphone asclaimed in claim 54, wherein the membrane comprises one or more openingscorresponding to one or more openings in the first electrode.
 58. Amethod as claimed in claim 57, wherein at least one of the openings inthe first electrode is larger than a corresponding opening in themembrane.
 59. A method of fabricating a micro-electrical-mechanicalsystem (MEMS) microphone, the method comprising the steps of: depositingfirst and second electrodes; depositing a membrane that it ismechanically coupled to the first electrode; and depositing a back platethat it is mechanically coupled to the second electrode; wherein thestep of depositing the second electrode comprises the step of forming apredetermined pattern in the second electrode, and wherein thepredetermined pattern comprises one or more openings.
 60. A method asclaimed in claim 59, wherein the one or more openings correspond to oneor more openings formed in the back plate.
 61. A method as claimed inclaim 60, further comprising the step of forming at least one of theopenings in the second electrode to be larger than a correspondingopening in the back plate.
 62. A method of testing a plurality ofmicro-electrical-mechanical system (MEMS) microphones formed on a wafer,each MEMS microphone comprising a membrane and at least one sacrificiallayer, the method comprising the steps of: attaching the wafer to acarrier: singulating the wafer to form two or more MEMS microphones;removing the at least one sacrificial layer; and testing the MEMSmicrophones while attached to the carrier.
 63. A method as claimed inclaim 62, wherein the carrier comprises a dicing tape.
 64. Amicro-electrical-mechanical system (MEMS) microphone comprising: asubstrate; first and second electrodes; a membrane that it ismechanically coupled to the first electrode; and a back plate that it ismechanically coupled to the second electrode; and further comprising: afirst cavity beneath the membrane, the first cavity formed using a firstsacrificial layer; and a second cavity between the first and secondelectrodes, the second cavity formed using a second sacrificial layer.65. A micro-electrical-mechanical system (MEMS) microphone as claimed inclaim 64, further comprising a third cavity, the third cavity connectingwith the first cavity to form a back volume.
 66. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim65, wherein the third cavity is formed such that the area of the thirdcavity at a plane where the third cavity meets the first cavity issmaller than the area of the first cavity, such that the area of thethird cavity in said plane falls substantially within the perimeter ofthe first cavity.
 67. A micro-electrical-mechanical system (MEMS)microphone as claimed in any one of claims 64, further comprising aplurality of openings in the material of the membrane, the plurality ofopenings connecting the first cavity and the second cavity.
 68. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim67, wherein the plurality of openings are located in an outer area ofthe first cavity, the outer area of the first cavity being outside thearea defined by the third cavity at the plane where the third cavitymeets the first cavity.
 69. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 68, wherein said openings are formed onone or more concentric circles in the outer area of the first cavity.70. A micro-electrical-mechanical system (MEMS) microphone as claimed inclaim 67, wherein the plurality of openings are arranged such that anarea etched through a first opening substantially overlaps an areaetched through an adjacent opening.
 71. A micro-electrical-mechanicalsystem (MEMS) microphone as claimed in claim 70, wherein the openingshaving a spacing of less than 100 um.
 72. A micro-electrical-mechanicalsystem (MEMS) microphone as claimed in claim 64, wherein the first andsecond electrodes each have a diameter that is different to the diameterof the membrane.
 73. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 72, wherein the diameters of the firstand second electrodes are smaller than the diameter of the membrane. 74.A micro-electrical-mechanical system (MEMS) microphone as claimed inclaim 73, wherein the diameters of the first and second electrodes areless than 90% of the diameter of the membrane.
 75. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim73, wherein the diameters of the first and second electrodes are lessthan 80% of the diameter of the membrane.
 76. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim73, wherein the diameters of the first and second electrodes are between50-70% of the diameter of the membrane.
 77. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim72, wherein the diameters of the first and second electrodes aresubstantially equal.
 78. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 64, further comprising a plurality ofopenings in the back plate.
 79. A micro-electrical-mechanical system(MEMS) microphone as claimed in claim 78, wherein at least some of theopenings in the back plate pass through the second electrode.
 80. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim64, further comprising one or more dimples on an inner surface of theback plate.
 81. A micro-electrical-mechanical system (MEMS) microphoneas claimed in claim 64, further comprising one or more dimples on asurface of the membrane.
 82. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 81, wherein the one or more dimples arelocated on a surface of the membrane facing the first cavity, and on theouter area of the membrane, the outer area of the membrane being outsidethe area defined by the third cavity at the plane where the third cavitymeets the first cavity
 83. A micro-electrical-mechanical system (MEMS)microphone as claimed in claim 64, further comprising electroniccircuitry on the same substrate as the MEMS microphone.
 84. Amicro-electrical-mechanical system (MEMS) microphone as claimed in claim64, further comprising one or more electrical interface pads forconnection to external electronic circuitry.
 85. An electronic devicecomprising a micro-electrical-mechanical system (MEMS) microphone asclaimed in claim
 48. 86. A communications device comprising amicro-electrical-mechanical system (MEMS) microphone as claimed in claim48.
 87. A portable telephone device comprising amicro-electrical-mechanical system (MEMS) microphone as claimed in claim48.
 88. An audio device comprising a micro-electrical-mechanical system(MEMS) microphone as claimed in claim
 48. 89. A computer devicecomprising a micro-electrical-mechanical system (MEMS) microphone asclaimed in claim
 48. 90. A vehicle comprising amicro-electrical-mechanical system (MEMS) microphone as claimed in claim48.
 91. A medical device comprising a micro-electrical-mechanical system(MEMS) microphone as claimed in claim
 48. 92. An industrial devicecomprising a micro-electrical-mechanical system (MEMS) microphone asclaimed in claim 48.